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Advanced Packaging Board Level Integration

Board Level Integration - Needs and Challenges White Paper

This white paper highlights the technical challenges from a system-level packaging perspective as advanced heterogeneous integrated packages are assembled on the board. The salient trends and challenges are addressed from design, materials, assembly processes, reliability, and metrology points of view.

Key topics areas discussed in the paper:

  • High-Performance Computing (HPC)
  • 5G/6G Wireless Communication
  • Autonomous Driving and EV
  • Medical Electronics
  • Aerospace & Defense Electronics
  • Design
  • Materials
  • Printed Circuit Board Assembly
  • Reliability
  • Metrology

The paper then analyzes the following aspects of advanced packaging and board-level integration:

  • Design challenges and co-design approaches
  • Power delivery solutions
  • Thermal management techniques
  • Materials innovation for package assembly and PCB integration
  • Printed Circuit Board Assembly (PCBA) challenges
  • Reliability considerations for complex systems
  • Metrology requirements for advanced packaging

Complete the Form and You Will Receive an Email with the Download Link

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