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IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem

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IPC recently convened a 2-day symposium in Washington, DC to discuss key business and technology issues surrounding the IC-Substrate and Package Assembly Ecosystem in North America and Europe. Commercial and Defense Electronic Industry leaders led presentations and in-depth discussions on opportunities and challenges for next-generation advanced packaging production, public policy updates, commercial and defense electronics technology drivers, current business environment for IC-Substrates and component assembly & test manufacturing.

Speakers represented the entire advanced packaging ecosystem and semiconductor supply chain: final system OEMs, component makers, HDI PCB fabricators, market leading IC-substrate fabricators, assembly & test manufacturers, equipment, and material suppliers. Four featured keynote presentations included senior leaders from Intel, US Department of Defense, SRC Semiconductor Research Corporation, and TechSearch International.

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Complete the form to access speaker presentations.