In PCB manufacturing, copper electroplating is essential for ensuring electrical conductivity, mechanical integrity, and the longevity of via connections. However, challenges like uneven copper distribution and material wastage have persisted. To address these, the industry is embracing advanced approaches such as automated copper thieving and digital twin simulations. These innovations support the principles of Design for Manufacturing (DFM) and pave the way for achieving Design for Excellence (DFX).
This paper explores the concept of automated copper thieving and the digital twin of the copper plating process in PCB manufacturing. These modern CAE tools facilitate the rapid assessment and mitigation of copper under- and over-plated surface areas, aligning closely with the principles of smart manufacturing.
